Molex has completed the acquisition of Smiths Interconnect, a subsidiary of UK-based Smiths Group.
Smiths Interconnect brings a diverse portfolio of complementary products and advantaged capabilities in ruggedised custom connectors, contacts, RF components and optical transceivers for harsh environments.
Smiths Interconnect also brings leading semiconductor test capabilities that complement Molex’s data communications and datacentre solutions to support growth in AI, along with a strong medical interconnect capability to support Medtech customers.

“We are excited to finalise the Smiths Interconnect acquisition, which expands our portfolio and engineering expertise worldwide,” said Joe Nelligan, CEO, Molex.
As the largest acquisition in Molex’s history, the addition of Smiths Interconnect positions Molex to drive innovation across the high-reliability interconnect market — encompassing aerospace, defence, space exploration, industrial, medical and semiconductor test industries.
The combination of Smiths Interconnect’s capabilities with Molex’s global footprint, engineering strength, culture and financial strength enables Molex to deliver increased value to customers around the world.
“This acquisition reinforces Molex’s position as a leader across every sector where high reliability is critical,” said Michael Cole, senior vice-president and president, Aerospace and Defense Solutions Division, Molex. “By unifying these high-reliability solutions under the Molex banner, we provide a borderless platform that enables engineers to leverage ruggedised, precision-engineered connectivity.”
The Smiths Interconnect acquisition expands Molex’s global footprint to more than 90 plants across 22 countries, and its global headcount to more than 55,000 employees.
Contact:
Phone:
E-mail: info@valuedcomponents.com
Add: 2A1110, Shine City, Longgang Blvd 1099, Longcheng Street, Longgang, Shenzhen 518172, China